LS101MASN7DFA
  • image of LS101MASN7DFA

LS101MASN7DFA

Category:
-
Manufacturer:
Description:
IC MPU QORLQ LS1 650MHZ 448PBGA
Package:
Packaging:
Tray
RoHS：
YES

Request a Quote

Stock 1600

Not satisfied with the price? Fill in the form below to send a quick RFQ and we will respond promptly.

Similar Models
SAMA7D65-E/4HB
Microchip Technology
CORTEX-A7 MPU, BGA, EXT 125C TEM
SAMA7D65T-E/4HB
Microchip Technology
CORTEX-A7 MPU, BGA, EXT 125C TEM
R9A09G047E57GBG#AC0
Renesas Electronics Corporation
SOC RZ/G3E 15BGA SECURE QUAD(BUL
GB171
Jameco Electronics
IC Grab Bag Micros, RAM, PROMs,
SAM9X70T-V/6GW-SL3
Microchip Technology
ARM926 MPU,BGA,EXT TEMP,T&R
SAM9X72-V/6GW-SL3
Microchip Technology
ARM926 MPU,LVDS,CAN-FD,BGA,EXT T
SAM9X70-V/6GW-SL3
Microchip Technology
ARM926 MPU,BGA,EXT TEMP,TRAY
SAM9X72T-V/6GW-SL3
Microchip Technology
ARM926 MPU,LVDS,CAN-FD,BGA,EXT T
R9A07G066M04GBG#AC0
Renesas Electronics Corporation
RZ/A3M BUILT-IN 128MB DDR3L 17MM
SAM9X70T-V/6GW
Microchip Technology
ARM926 MPU,BGA,EXT TEMP,TRAY,T&R
Specifications
Part Status
Obsolete
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C (TA)
Co-Processors/DSP
-
Graphics Acceleration
No
Display & Interface Controllers
-
SATA
-
Security Features
-
Number of Cores/Bus Width
1 Core, 32-Bit
Core Processor
ARM1136JF-S
USB
USB 2.0 + PHY (1)
RAM Controllers
DDR2
Ethernet
GbE (2)
Speed
650MHz
Package / Case
448-FBGA Exposed Pad
Supplier Device Package
448-PBGA w/Heat Spreader (23x23)
Additional Interfaces
I2C, PCIe, PCM/TDM, SPI, UART