XC3S2000-4FGG456C
  • image of XC3S2000-4FGG456C

XC3S2000-4FGG456C

Category:
-
Manufacturer:
AMD
Description:
IC FPGA 333 I/O 456FBGA
Package:
Packaging:
Tray
RoHS：
YES

Request a Quote

Stock 1600

Not satisfied with the price? Fill in the form below to send a quick RFQ and we will respond promptly.

Similar Models
MPF200TC-FCSG325E
Microchip Technology
POLARFIRE CORE FPGA, 192KLES
MPF300TC-FCVG484I
Microchip Technology
POLARFIRE CORE FPGA, 300KLES
MPF300TC-FCG484I
Microchip Technology
POLARFIRE CORE FPGA, 300KLES
MPF300TC-FCG784E
Microchip Technology
POLARFIRE CORE FPGA, 300KLES
MPF300TC-FCG1152E
Microchip Technology
POLARFIRE CORE FPGA, 300KLES
MPF300TC-FCG1152I
Microchip Technology
POLARFIRE CORE FPGA, 300KLES
MPF100TC-FCSG325E
Microchip Technology
POLARFIRE CORE FPGA, 109KLES
MPF200TC-FCG784I
Microchip Technology
POLARFIRE CORE FPGA, 192KLES
10M08SLV81I8G
Altera
FPGA MAX10 56 I/O 81WLCSP
10M08SLV81C8G
Altera
FPGA MAX10 56 I/O 81WLCSP
Specifications
Part Status
Obsolete
Mounting Type
Surface Mount
Programmable
Not Verified
Operating Temperature
0°C ~ 85°C (TJ)
Package / Case
456-BBGA
Supplier Device Package
456-FBGA (23x23)
Total RAM Bits
737280
Number of I/O
333
Voltage - Supply
1.14V ~ 1.26V
Number of Gates
2000000
Number of LABs/CLBs
5120
Number of Logic Elements/Cells
46080